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Palladium Coated Copper Wire designed to enhance durability and conductivity in semiconductor packaging and electronic assembly

Palladium Coated Copper Wire designed to enhance durability and conductivity in semiconductor packaging and electronic assembly

Palladium coated copper wire for semiconductors

Durable palladium copper wire electronics

High conductivity palladium coated wire

Plaats van herkomst:

China

Merknaam:

WINNER

Certificering:

ISO9100

Modelnummer:

PW-12

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Productdetails
Pakket:
Spoel
Oppervlakteafwerking:
Helder
Corrosiebestendigheid:
Hoog
Beschikbaarheid:
Aangepaste formaten beschikbaar
materiaal:
Koper
Producttype:
Bindingsdraad
Coating:
Palladium
Lengte meters:
500/1000
Temperatuurbereik:
-40 ° C tot 200 ° C
Geleidbaarheid:
98%
Pakketgrootte:
100 meter
Bindingssterkte:
Hoog
Markeren:

Palladium coated copper wire for semiconductors

,

Durable palladium copper wire electronics

,

High conductivity palladium coated wire

Betaling & het Verschepen Termijnen
Min. bestelaantal
6 dagen
Prijs
999
Verpakking Details
Roll, neutrale verpakking of met OEM -logo
Levertijd
5-8 werkdagen
Betalingscondities
L/C, Western Union, T/T -leveringsvermogen
Levering vermogen
100000 rollen per maand
Productomschrijving
Palladium Coated Copper Bonding Wire

Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.

The Pd coating also extends the Highly Accelerated Stress Test (HAST) reliability. It prevents corrosion of the bonded wire span against halide attack from moulding compounds.

Key Advantages
  • Enhanced bonding performance and stability
  • Superior oxidation control on copper surface
  • Extended HAST (Highly Accelerated Stress Test) reliability
  • Corrosion protection against halide attack from molding compounds
  • Wider bonding parameter window
Performance Benefits
  • High bonding reliability is obtained by stable palladium distribution to FAB surface layer
  • High and stable stitch bondability
  • Wide bonding window


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