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Huis > producten > Palladium gecoate koperdraad >
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

15um palladium coated copper wire

ultra fine palladium copper wire

chip packaging palladium coated wire

Plaats van herkomst:

China

Merknaam:

WINNER

Certificering:

ISO9100

Modelnummer:

PW-12

Contacteer ons
Verzoek om een Citaat
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Productdetails
Dikte van de coating:
5 micron
Temperatuurbereik:
-40°C tot 150°C
Beschikbaarheid:
Aangepaste formaten beschikbaar
Geleidbaarheid:
98%
Elektrische geleidbaarheid:
Uitstekend
Nalevingsnormen:
RoHS, REACH
Kleur:
Zilver
Treksterkte:
Hoog
Zuiverheid:
990,9% koper
Oppervlakteafwerking:
Gladde, glanzende palladiumlaag
Pakketgrootte:
100 meter
Treksterkte:
Hoog
Bedrijfstemperatuurbereik:
-40°C tot 150°C
Coatingmateriaal:
Palladium
Oppervlakteafwerking:
Gladde, glanzende palladiumlaag
Coatingmateriaal:
Palladium
Markeren:

15um palladium coated copper wire

,

ultra fine palladium copper wire

,

chip packaging palladium coated wire

Betaling & het Verschepen Termijnen
Min. bestelaantal
1 ST
Prijs
999
Verpakking Details
Roll, neutrale verpakking of met OEM -logo
Levertijd
5-8 werkdagen
Betalingscondities
L/C, Western Union, T/T -leveringsvermogen
Levering vermogen
100000 rollen per maand
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Productomschrijving
Ultra Fine Palladium Coated Copper Wire 15um 20um 25um Bonding Wire for Chip Packaging
Product Overview

Ultra fine Pd coated copper bonding wire designed for advanced chip packaging with fine pitch and high-density interconnections.

  • Available in 15μm, 20μm, and 25μm diameters
  • Palladium coating for enhanced performance
  • Ideal for fine pitch applications
  • Optimized for high-density interconnections
  • Advanced chip packaging solutions


Company Information
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 0 Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 1 Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 2 Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 3
Markeringen：

Palladium gecoate koperdraad

Pd beklede cu-draad

Corrosiebestendigheid

Rechtstreeks uw onderzoek naar verzend ons

Tel.：86-158-1857-6616
E-mail：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. concentreert zich op ultra-fijn gecoate metalen draad voor halfgeleiderverpakkingen.
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