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0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

ultra fine ag bonding wire

anti-corrosion semiconductor bonding wire

industrial ag wire for modules

Plaats van herkomst:

China

Merknaam:

WINNER

Certificering:

ISO9100

Modelnummer:

MW001

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Productdetails
Producttype:
Bindingsdraad
Materiaal:
Ag
Pakket:
Spoel
Oppervlakteafwerking:
Helder
Geleidbaarheid:
98%
Sollicitatie:
Halfgeleiderverpakking, micro -elektronica, medische hulpmiddelen
Markeren:

ultra fine ag bonding wire

,

anti-corrosion semiconductor bonding wire

,

industrial ag wire for modules

Betaling & het Verschepen Termijnen
Min. bestelaantal
1 st
Prijs
999
Verpakking Details
Roll, neutrale verpakking of met OEM -logo
Levertijd
5-8 werkdagen
Betalingscondities
L/C,Western Union,T/T
Levering vermogen
100000 rollen per maand
Productomschrijving
0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

Durable anti-corrosion property, long service life for industrial semiconductor integrated modules.
Product Description 
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low Resistivity (SEC Type)
  • Soft FAB (SEC type)
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