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Huis > producten > Binddraad >
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

gold alloy bonding wire

silver alloy bonding wire

IC packaging bonding wire

Plaats van herkomst:

China

Merknaam:

WINNER

Certificering:

ISO9100

Modelnummer:

MW001

Contacteer ons
Verzoek om een Citaat
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Productdetails
Applicatie:
Halfgeleiderverpakking, micro -elektronica, medische hulpmiddelen
Pakket:
Spoel
Corrosiebestendigheid:
Hoog
Materiaal:
Goud
Lengte meters:
500/1000
Producttype:
Bindingsdraad
Coating:
Goud
Bindingsmethode:
Ultrasoon
Temperatuurbereik:
-40 ° C tot 200 ° C
Oppervlakteafwerking:
Helder
Geleidbaarheid:
98%
Markeren:

gold alloy bonding wire

,

silver alloy bonding wire

,

IC packaging bonding wire

Betaling & het Verschepen Termijnen
Min. bestelaantal
1 ST
Prijs
999
Verpakking Details
Roll, neutrale verpakking of met OEM -logo
Levertijd
5-8 werkdagen
Betalingscondities
L/C,Western Union,T/T
Levering vermogen
100000 rollen per maand
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Goede prijs 24K Gold Bonding Wire 1mm Diameter for Microelectronics with 4N 99.99% Purity online Video

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Contacteer ons
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Productomschrijving
Gold Bonding Wire Au99.99% - 100m Per Spool (0.025mm Diameter)
High purity 99.99% (4N) fine gold wire for scientific research, medical, aerospace, and electrical applications. Offers excellent electrical properties and low reactivity for stability in harsh environments.
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%
Gold wire provides exceptional electrical conductivity and durability, making it ideal for precision applications requiring stability in demanding conditions. Available in round or ribbon form, pure or mixed with beryllium for semiconductor applications.
Medical Applications
  • Electrosurgery equipment
  • Guide wires and stents
  • Life-support devices
  • Medical markers for X-rays (provides radiopacity)
  • CV therapies
  • In vitro diagnostic devices
Aerospace Applications
  • Wire-wound potentiometers
  • Aerospace instrumentation (avionics)
  • Radio communication equipment
  • Temperature regulation sensors
Electrical Applications
  • Imaging devices and televisions
  • Smartphones and computers
  • LED technology
  • Orthodontic appliances
  • Wire bonding for integrated circuits
  • Motherboard connections and microprocessor mounting
Product Images
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 0
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 1
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 2
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 3
Markeringen：

Aluminiumbanddraad

draadbindingsdraad

gold alloy bonding wire

Rechtstreeks uw onderzoek naar verzend ons

Tel.：86-158-1857-6616
E-mail：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. concentreert zich op ultra-fijn gecoate metalen draad voor halfgeleiderverpakkingen.
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